INTRACOM Defense Electronics has significant experience in the development, design, qualification and production of Missile Electronics for use in a variety of applications.
INTRACOM Defense Electronics at a Glance
Greece's largest manufacturer of defense electronics products, systems and applications
Focusing primarily on the armament programs of Greek and foreign defense ministries and NAT
Achieved course and experience in Greece and abroad from 1992
Participation in a series of international defense system development and production programs
Co-production in collaboration with leading international manufacturers in the defense field
High level and experienced personnel. Scientific Staff 54%.
Significant international activity: 72.6% exports of annual turnover of year 2010, sales in England, Belgium, France, USA, Spain, Cyprus, Holland and Sweden
Pioneer in Research & Development investing important persentage of annual turnover
State-of-the-art research laboratories for fast development and testing of new innovative products
Modern and high level industrial infrastructure
Strategic collaborations with major international defense manufacturers
Our extensive experience in defense programs and the know-how accumulated over the years in development of new products, bring INTRACOM Defense Electronics into the dawn of a new era of military technologies, where the transfer and management of information is the corner stone of any modern battlefield.
INTRACOM Defense Electronics aspires to be the leader into a new generation of tactical communications and information technology systems where broadband transmission can be extended though out the chain of command even to the last soldier. Security, mobility and integrated services are all part of INTRACOM Defense Electronics’ military standard networks, which can serve all branches of the Armed Forces and Homeland Security Services.
In parallel, INTRACOM Defense Electronics remains a valuable industrial partner in a wide range of defense applications. With continuing investment in R&D and production infrastructure, INTRACOM Defense Electronics participates in numerous national and international programs, offering its services in the design, development, integration and verification of the defense electronics systems.
INTRACOM S.A. DEFENSE ELECTRONIC SYSTEMS (INTRACOM Defense Electronics) derives from the former INTRACOM S.A. HELLENIC TELECOMMUNICATIONS & ELECTRONICS INDUSTRY (INTRACOM) established in 1977.
In December 2005 INTRACOM was transformed into a holding company by establishing three new subsidiaries: INTRACOM TELECOM (telecommunications solutions), INTRACOM Defense Electronics (defense electronic systems) and INTRACOM IT SERVICES (IT solutions and services).
The business sector “Defense Electronic Systems” has been spun off by INTRACOM and has been absorbed by INTRACOM Defense Electronics. Thereby the rights and obligations of INTRACOM related to the activities of the above business sector have been transferred in whole to INTRACOM Defense Electronics.
INTRACOM's history and development since its establishment in 1977 is presented herein below:
With 10 employees and start-up capital of €15,000, the company begins operating in Argyroupoli, a suburb of Athens, as a small manufacturer and assembler of telecommunications equipment.
Intracom transfers its head offices to Peania, a town near Athens, strategically investing in research, development, and manufacturing of state-of-the-art telecommunications products.
Intracom, in collaboration with Ericsson, qualifies to participate in the upgrading of Greece's national telecommunications network. Most of the systems deployed are manufactured in Greece by Greek engineers.
The company evolves into a large industrial unit capable of mass production, and its research activities are focused on advanced telecommunications and information technology. In 1987, Intrasoft, a subsidiary specializing in the integration of large-scale IT projects, and Intracom Constructions, a subsidiary specializing in complex construction projects mainly in the energy sector, are established in Athens. After just 13 years of successful operation, Intrasoft is ranked by IDC among the top 100 European IT service providers.
Intracom becomes the largest ICT systems provider in Greece and prepares the ground for its international expansion. In 1990, Intracom is listed on the Athens Stock Exchange. In 1992, Intrakat, a subsidiary construction company specializing in large-scale telecommunications infrastructure projects, is established in Athens. The same year, Intracom successfully extends its activities to include high-tech defense electronics systems production. In 1993 Intracom participates in the deployment of the Attica telecommunications network ring. In 1994, Intracom Constructions merges with Intrakat. In 1996, Intrasoft International is established in Luxembourg and within nine years of successful operation is positioned among the primary IT service providers to EU Institutions.
Intracom develops into a multinational group of companies and actively participates in the modernization, upgrading, and expansion process of the national telecommunications networks of Greece, Romania, Armenia, and Moldova. In 1999, Intracom is ranked 70 th among the 200 fastest growing companies (out of 12,000) from 25 countries. In 2001, Intrakat is listed on the Athens Stock Exchange. In 2002, Intrasoft merges with Intracom, and the new company becomes the largest ICT conglomerate in Southeast Europe. The same year, AIT starts its operation. Since 2000, IDC, the international market analysis firm, has consistently ranked Intracom as the leading IT service provider in Greece.
2005 - 2006
A new growth cycle begins. In December 2005, Intracom is transformed into a holding company and three new subsidiaries are established : INTRACOM TELECOM , INTRACOM IT SERVICES and INTRACOM Defense Electronics, in the fields of telecommunications, information technology, and defense electronics respectively.
As from Monday 23rd of January 2006, the Company name of INTRACOM S.A. HELLENIC TELECOMMUNICATIONS AND ELECTRONICS INDUSTRY (INTRACOM) changed to "INTRACOM HOLDINGS S.A." with the distinctive title "INTRACOM HOLDINGS".
INTRACOM Defense Electronics is the largest manufacturer of defense electronics products, systems and applications in Greece.
The nature of the business, the requirements set by collaborating companies and the compliance regulations set by the relevant authorities require the special handling of all information, in accordance with the Hellenic Ministry of Defense guidelines.
The company applies all the procedures and the control, which are required by the Industrial Security Regulation (issued in February 2005 by the Hellenic National Defense General Staff). It is registered in "Registry of Defence Material Manufacturers of the Hellenic Ministry of Defense” and is certified by the same Authority for security clearance level SECRET – NATO SECRET – EU SECRET.
The procedures and the guidelines concerned the protection of:
The classified information (documents, software etc.)
In order to avoid the:
Unauthorized access to company premises and
Unauthorized access and exposure of Classified information
INTRACOM Defense Electronics Manufacturing is clearly identified as a flexible volume, high performance, and cost effective electronics manufacturer investing in its Human Resources.
INTRACOM Defense Electronics’ manufacturing capabilities cover the entire spectrum of defense product operations with a remarkable ranking in the international defense systems market as a company with excellence in manufacturing infrastructure, high level of quality, flexibility, competitiveness, commitment in time schedules and focused on customer satisfaction.
Factors with significant contribution to the above achievements are Human Resources, Manufacturing Infrastructure and the established Process Control systems.
INTRACOM Defense Electronics invests in the continuous training and certification for all levels of the production personnel. More than 40% of the production personnel (Technicians, engineers, administrative and supporting personnel), are College and University graduates. Production personnel are trained and/or certified to international solder and assembly industry standards, such as IPC/J-STD-001D, IPC-7711, 7721, etc.
Continuous training programs are in place aiming to the improvement of personal knowledge, skills and expertise, in an effort to maintain position on the edge of technology.
The gained experience in the design of work systems and selection of manufacturing methods for optimum product flow ensures the achievement of High Quality within reasonable time and cost.
INTRACOM Defense Electronics Manufacturing Department consists of:
Industrial Engineers involve with the development of Technical Capabilities, the continuous improvement of Quality and Productivity and the elimination of the waste of any kind. Main activities are the analysis, design and development of production methods, the selection manufacturing and installation of production equipment, the introduction of new products and validation of production operations, monitoring and analysis of technical characteristics, quality - productivity metrics and improvement proposals.
Test Engineers have design and technical support skills for providing integrated solutions and services in the Product and Systems Testing field for a wide range of applications and technologies. Testing areas cover functional testing for high-speed digital electronics, analog electronics, low and high voltage power supplies, low and high-power RF as well as boundary-scan (JTAG), in-circuit and extensive ESS (Environmental Stress Screening) testing, including full operational test during thermal cycling, vibration and thermal shock. Testing capabilities can cover CCA (Circuit Card Assembly) and LRU (Line Replaceable Unit) level, as well as system-level testing.
The company has acquired considerable expertise in a wide range of industrial testing operations, developing and manufacturing advanced and modern testing solutions (Testers) which cover all the test specifications for every manufactured product.
Production Planning and Scheduling
Integrated Production Planning and Control is performed via the company’s (Enterprise Resource Planning) System, SAP R3.
The Manufacturing Plants section is responsible for the management of all operations within INTRACOM Defense Electronics’ production plants
The total Manufacturing floor space is 7500m2. laid out in two production plants. This infrastructure includes an impressive and diverse number of manufacturing and testing equipment, which guarantees manufacturing of high quality products to the most strict and demanding specifications. Production lines are designed for optimum product flow, aiming to productivity improvements. The products and processes are monitored and tested for specification compliance, at critical control points utilizing automatic test equipment and Computer Aided techniques.
The existing production capabilities are the outcome of a continuous and vigorous investment program which includes the purchase of new equipment and development of new production methods and techniques with state of the art production automation. The areas covered are the following:
Printed Board Assemblies
Surface Mount Technology assembly lines
Reflow and Vapor Phase Soldering
Wave Soldering (ROHS and Conventional)
Press Fit Components
Manual assembly lines
PBA Repair and Rework Centre per IPC7711 and IPC7721.
Cable and Harness Assembly
Automated Cut and Stripping Machines
Variety of semi-automatic and special hand tools
Harness assembly, Coaxial(RF), Power, Signal Distribution, Special Purpose Cables
Semi rigid Cables
Coil and Transformer winding Machines
Manual assembly of electromechanical products (Racks, Panels, Cabinets, etc.)
Standard Rework Procedures for Mechanical parts.
In order to improve the mechanical and environmental durability of the products, a number the following special processes are performed with the application of chemical compounds in a controlled environment using trained-qualified personnel and specific to type automatic equipment.
Application of Conformal Coating
Application of Bonding Materials
Cleaning and Cleanliness Measurements
Potting / Molding
Processes which require a clean and controlled environment (for optical parts, contamination sensitive products, etc) are performed in the existing clean room areas with ISO cleanliness class levels 7 and 8.
System Integration and Test
System integration and test operations (vehicles, shelters, etc) are performed in a special industrial area equipped with the relevant facilities and a 10 tons overhead crane.
Automatic Test & Inspection Equipment
Soldering processes (X-Ray 2D Inspection)
In-Circuit Testing (bed of nails, flying probe)
Environmental Testing (Thermal - Mechanical Stress, Rain and Altitude Simulations)
Printed Circuits Board Production
INTRACOM Defense Electronics operates a Printed Circuit Boards Unit to meet the requirements for high standard and fast turn-around production of prototype boards and limited quantities of multilayer boards. The production meets the IPC-600 standard.
Environmental Test LaboratoryTo ensure reliable operation of company's products under
various climatic conditions, INTRACOM Defense Electronics has established an Environmental Test Laboratory where newly developed products are validated for their performance under adverse environmental conditions of operation.
The laboratory performs tests on products during the design phases (prototypes) as well as during product qualification and production validation. The Environmental Test Laboratory offers its services to external customers as well.
The test capabilities are based on military and international standards (MIL-STD-810, IEC 60068, ETSI 300 019) and include the following:
Temperature and Humidity
Vibration (Sine, Random)
Mechanical Shock (Half-sine)
Impact Test (Spring-operated)
EMC/ TEMPEST LaboratoryINTRACOM
Defense Electronics has established and operates a TEMPEST and Electromagnetic Compatibility (EMC) measurements laboratory, according to NATO and military standards, which provides the capability to test national encryption devices and military electronic equipment designed and manufactured by the company.
Services are provided also to other companies which are interested in order their products to comply with the applicable military standards.
The laboratory offers a range of EMC testing services in accordance with MIL-STD 461A, B, C and E, British DEF STAN 59-41 and German VG 9537x series.
All EMC tests are performed within TEMPEST/EMC shielded enclosures offering 110/230V AC and DC filtered power and providing the necessary isolation and setup requirements.
The main chamber is lined with cone absorbers for upgraded performance up to 40GHz.
Other capabilities include Shielding Effectiveness measurements, per MIL-STD-285 and NSA 65-6, for shielded enclosures or cabinets for fixed and mobile installations. In addition, on-site measurements in Electromagnetic Security (EMSEC) enclosures can be performed at customer's premises.
The laboratory is fully equipped with specialised instruments and the staff has been trained and registered by CESG ( UK National Government Authority ) as approved testing engineers performing on-site TEMPEST and Certification test to the NATO AMSG720B, AMSG788A, AMSG784B and SDIP-27 standards.
The laboratory provides TEMPEST services, preparation of TEMPEST control plans and test reports, as well as NATO Zone testing and Electromagnetic Security (EMSEC) design assistance to the NATO AMSG719G and SDIP-29 standard.
The main purpose of the lab is to test, repair and calibrate INTRACOM's test and measurement instruments as well as to offer these services to external customers.
INTRACOM Defense Electronics' Calibration Laboratory offers services in the following major metrological sectors:
Electrical/Electronic measuring instruments (DC to microwave)
Communications and Telecommunications instruments
Temperature measuring instruments
Pressure measuring instruments
Dimensional measurements and mass
The Electrical Measurements Lab is accredited according to IS0/IEC 17025, by the German National Institute of Metrology (PTB) and the German Calibration Services (DKD) with registration no. DKD-K-28501 for DCV, DCI, ACV, ACI, DC-R, Frequency & Time Interval.
The Temperature Measurements Lab is accredited by the Hellenic Accreditation Council (ESYD) with registration no. 39/01.
ISO 9001 (BVQI Certificate No 78338/A) since 1994.
ISO GUIDE 25-General requirements for the competence of calibration and test labs (Hewlett Packard, 1996)
The services cover the following disciplines:
On Site Visits
Consultation Services for evaluation, selection and installation of new test and measurement equipment
Upgrading of existing instrument
The capabilities of the Laboratory include:
Multi meters, Amp meters, Voltmeters, Console instruments
Analysers (Spectrum, Network, Communication)
RF Level meters
High end power supplies
Calibrators & reference cells
Manometers & pressure transducers
Callipers, micrometers, balances, etc
Instruments are delivered with:
Performed measurements and issued calibration reports are traceable to PTB (Germany), NPL (England) and EIM (Greece).
Types of certificates option:
ISO17025 Accredited – Highest cost
ISO9001 with data report and uncertainties- Mid cost
ISO9001 with data report (without uncertainties)- Lower cost
High accuracy measurements are performed inside an environmentally controlled shielded chamber (temperature, humidity & dust).
Independent UPS and generator provide shelf sufficient operation
Technical procedures library
Technical manuals library
Database for all instruments
Records include measurements, planning & instrument recalls.
PCB Testing LaboratoryThe Laboratory's main function is the in-depth high quality inspection and thorough testing of multi-layer printed circuit boards (PCB) for good performance.
The Laboratory is fully equipped with modern and state-of-the-art testing equipment, and is manned by qualified and experienced scientific personnel. All the expert engineers in charge of the testing procedures undergo continuous technological and scientific training, and are certified according to IPC-A-600 international standards.
The Laboratory has a successful 15-year long track record in the fields of Optical and Dimensional Measurements and Micro-Sectioning Testing, with applications in the areas of electronics products manufacturing and raw materials inspection (e.g. PCBs).
The Laboratory, apart from its main involvement in INTRACOM Defense Electronics' manufacturing procedures, offers its expert services to third-party companies and individuals, under respective agreements.
Optical and Dimensional Measurements
This testing procedure is performed under pre-approved drawings, plans, films and respective specifications. The specialized equipment used in this procedure are:
Electronic microscope with 40x magnification, equipped with photographic camera capability
X-Y measurement bench connected to a PC, with dimensional measurements capability of high accuracy, resolution and sensitivity
This testing procedure is performed on printed circuit boards where the dimensions (length, width, height) of coats (Cu, Ni, Au, C solder resist) and dielectric materials are measured. The specialized equipment used in this procedure are:
Hydraulic punch press (for shaping high-quality testing samples)
Electronic microscope with 1000x magnification, equipped with embedded micrometer and photographic camera capability
Soldering bath (for solderability tests)
This testing procedure is applied on any surface and helps to identify specific metals / alloys.
The X-Ray Fluorescence (XRF) is a spectroscopic method, while it is wholly non-destructive.
The device used for this testing is the NITON XL3T Analyzer.
Research & Development
INTRACOM Defense Electronics is devoted to designing and developing state-of-the-art products and systems that cover a wide spectrum of cryptographic equipment, tactical communications systems and other defense products.
INTRACOM Defense Electronics' research laboratories maintain a high level of specialisation and are equipped with modern infrastructure.
The main defense R & D Laboratories are the following:
Digital & VLSI Laboratory
Analog Electronics and Electroacoustic Laboratory
Power Supply Laboratory
RF and Wireless Systems Laboratory
Mechanical Engineering Laboratory
Systems Integration Laboratory
Digital & VLSI Laboratory
The main activity of the Digital and VLSI Laboratory of INTRACOM Defense Electronics is the design and development of all the digital circuits and VLSIs of the company’s products, applications and systems.
Consisting of engineers with a high degree of specialization and experience in the analysis, design, development and verification, the laboratory is equipped with the latest tools in hardware and software.
Broad design capability covers an extensive range including high speed boards as well as very low power consumption PCBs designed for battery operated portable devices.
High speed boards incorporate:
Digitals Signal Processors (32 bit floating & fixed point DSPs e.g. TMS320C64000)
Network processors along with large and complex latest genaration FPGAs such as Virtex 6, Spartan 6, Cyclon 3 etc.
On low power designs the use of ARM core microcontrollers enables low power consumption without compromise on processing power.
The high expertise and experience of the Laboratory is proven by the successfully conducted projects in a variety of defence applications, including Missile Electronics, Data Links, Cryptographic Systems, Intercom Systems, Radio Remote Control Systems & Radio Systems etc.
In all designs, military standards for EMI/EMC specifications are taken into consideration.
Analog Electronics and Electroacoustics Laboratory
The Analog Electronics and Electroacoustics Laboratory activities include:
Analog and mixed-mode electronics design for analog signal conditioning from DC to 10MHz, with main specialization in audio systems design.
Design and Field Testing of Dynamic Noise Reduction and Voice Activation Algorithms.
Electroacoustics design and measurements.
Digital Signal Processing of Audio and Video signals, with main expertise on audio systems.
The high expertise and experience of the personnel is proven by the successfully conducted R&D projects in a variety of defense applications, including Missile Telemetry Signal Conditioning, Audio interface of Intercom Systems, Audio interface of Radio Remote Control Systems, Infrared camera analog Video Acquisition, Physical layer circuits for telecom standards, DSP-based noise reduction for voice (mode than 20dB in-band for 120dB external noise, Greece and USA patented), Voice compression @2400bps (custom algorithm), Loudspeaker design, Earphone/ Microphone evaluation, and In-situ acoustical field measurements.
Technologies used include FPAA (Field Programmable Analog Arrays), SMT discrete and integrated components, DSP Analog Devices and Texas Instruments, High Noise Level Communications, MLS-based measurements while specialized tools (like ICAP4/WINDOWS (Spice), Matlab, Simulink, Super Filter/ Filter Master Active, Passive, and Protel) are used for simulation and design.
A fully equipped analog electronics and electroacoustics laboratory with Variable acoustic characteristics Acoustics Laboratory, MLSSA (analog/ electroacoustics system analyzer), UPL, Rohde & Schwarz Audio Analyzer, Symphonie, 01dB Real Time Acoustic Analyzer, Head & Torso Acoustic Simulator, Brüel & Kjær, Audio Power Amplifier, Audio signal generator, Brüel & Kjær, Arbitrary signal generators (up-to 10MHz), Oscilloscopes, Laboratory Power Supplies, ensures reliable designs and thorough investigation of their characteristics.
The analog electronics and electroacoustics laboratory has also active cooperations with Universities, Technological Educational Institutes and Military R&D Agencies.
Power Supply Laboratory
The Power Supply Laboratory of INTRACOM Defense Electronics designs, develops and verifies power supplies, power supply systems, power generation systems, power control and power distribution networks. Design work follows Military Standards and specific product/customer requirements on Safety, Data Security, and Electromagnetic Compatibility.
All prototype Development and Engineering work is accomplished in a dedicated and fully equipped Power Supply Laboratory which can also carry low volume productions on demanding projects
Highly experienced personnel and years of accumulated know-how guarantee work effectiveness and final product reliability. More specific, Power Supply Lab has proven experience in the following areas:
Missile power supplies
"Crypto" power supplies and subsystems
Distribution networks and power systems for stationary and mobile stations.
Power Supplies for vehicle electronics.
Power System Integration.
Crypto Laboratory is responsible for the development and verification of the algorithms that are used in the SecLine, WISPR and WIWAN products of INTRACOM Defense Electronics as well as for the development of all the crypto-devices (SecLine IP, SecLine MBit and SecLine a-Plus). It also incorporates cryptographic solutions in various communications systems.
For realization of the above, a modern infrastructure exists including both skilled personnel and expensive equipment. Existing knowledge includes the latest in secure communication systems and cryptographic algorithms.
From the hardware point of view, the most recent methods and advanced architecture is used in the following specialized area of cryptography:
Red and Black circuit separation for more effective isolation of the sensitive information
Design according to Tempest specifications
True random generators, hardware implemented
Tamper protection and Erase switch for immediate deletion of all sensitive information from device in case of need
Integrated system for Crypto Keys Management that provides high security levels during the creation, distribution and loading of the Crypto Keys into the devices
RF and Wireless Systems Laboratory
The activities of this Laboratory are mainly focused on the design and development of :
Wireless Systems of various network topologies (e.g., Point to Multi-point, point to point, ad-hoc, mesh) and
RF Data links (e.g. for high bit rate Telemetries, Μissile Data Links)
Extensive Know – how of INTRACOM Defense Electronics includes among other:
Transceiver system design,
State of the art software radio modem design using re-programmable devices (e.g., DSPs and FPGAs),
High power RF amplifiers and
Antenna design, development, measurements & manufacturing for custom applications (e.g. Missiles, shipboard antennas etc.).
Depending on the target application, modulations applied vary from :
high capacity 16 and 64 QAM using OFDM for multipath immunity
to high robustness differential and/or spreaded low-order modulations using DS-SS
Fast Frequency Hopping.
Moreover, adaptive anti-jamming techniques combined with adaptive modulation techniques give to the radio designs the flexibility to dynamically adapt to the demanding and rapidly varying operational environment of today’s battlefield.
The system design is being done using state-of-the art simulation tools from the overall system down to the target circuit in order to drastically decrease development time by predicting to the highest possible degree the system’s response to the required specifications and operational conditions.
Hardware development in the Lab of INTRACOM Defense Electronics is done using latest technology multi-layered PCBs (eg. RO 6002), able to function and pass the most demanding environmental specifications tests.
The designed systems are being tested and evaluated using state-of-the-art lab equipment, such as Mixed Signal Generators, Network Analyzers, Mixed Signal Analyzers etc.
Moreover, before performing the time consuming but necessary field tests and trial campaigns in the actual operating conditions, the systems’ behaviour is been exhaustively tested using an radio channel emulator which can apply in a deterministic way different radio channel and interference scenarios, in order to identify potential degradations and make fine trimming of our systems at the earliest stage possible of the development.
Where special cases exist, INTRACOM Defense Electronics has developed antennas able to operate under the more demanding electromagnetic environment (such as for Military Ships)
Mechanical Engineering Laboratory
The main activity of the Mechanical Engineering Laboratory is the design and development of all the mechanical parts of INTRACOM Defense Electronics' products, applications and systems.
Consisting of engineers with a high degree of specialization and industrial experience in the design, development, manufacturing, and mechanical prototype construction and equipped with the latest tools in hardware and software, this laboratory is in position to support any complex system mechanical design activities.
Relying on its know-how and experience the Lab covers Conceptual Design, Detailing, Analyses and Simulations, Prototyping, and Tooling up to Full Production.
Knowledge of diverse manufacturing processes and their constraints imposed on the design, rules for Design for Cost, assemblability and producibility, coupled with the use of Finite Element Method for Linear and Non-Linear Static and Dynamic Analyses as well as thermal management of electronic components and systems using Computational Fluid Dynamics (CFD) coupled with heat transfer analyses, is the key element for the innovative mechanical development in our Laboratory.
The mechanical design work is augmented with a good knowledge of MIL-Stds and special processes, IEC, EN, DIN, and ETSI standards.
Supplementary to the development activities is the creation of the Technical Data Package with the use of AutoCad software package. “Paper-less” prototype creation in the Laboratory’s Machine-Shop, which is equipped with state-of-the-art 4-axis CNC Milling Machines, is common practice through the use of I-DEAS MS12 and UGS NX6 CAD/CAM/CAE software package that encompasses all design, analysis, and manufacturing software modules.
Continuous efforts to enrich the Laboratory’s know-how with new manufacturing techniques and methodologies and successful response to the challenges, will play a significant role in the success of the company’s next generation products and systems.
The Defense Systems Integration Laboratory of INTRACOM Defense Electronics is an integration environment that has been designed not only for testing but also for developmental and systems’ interoperability purposes.
For that reason, the Laboratory hosts a wide range of dedicated systems and general-purpose advanced equipment that provide the entire required infrastructure.
The Laboratory has been also equipped with an autonomous high speed local area network and simulation environment which provides the test-bed for advanced R&D projects. The infrastructure allows to integrate system of systems (SoS) and to provide a complex synthetic test environment for Network Centric applications.
Integration capabilities and processes have been designed in order to accommodate incremental development strategies necessary for rapid and effective development in large-scale projects as well as to assure high quality standards of the products / solutions.
It provides the infrastructure and experience for the integration of complex projects such as:
Tactical Communications Systems
Tactical and Strategic Networks
Command, Control, Communication and Information(C3I) Systems
Local and Central Management Systems
In the Laboratory environment several systems / subsystems can be tested such as : Physical & Data Link layers for communication protocols, Routing and mobility algorithms for Tactical Ad-Hoc and Backbone Networks, Information Protection & Information Distribution algorithms products and voice, data and video applications for wired / wireless networks.